Preliminary study of the thermal impact of a microelectrode array implanted in the brain

被引：0

作者：

Kim, Sohee ^{[1
]}

Normann, Richard A. ^{[2
]}

Harrison, Reid ^{[1
]}

Solzbacher, Florian ^{[1
,2
]}

机构：

[1] Univ Utah, Dept Elect & Comp Engn, 50 S Cent Campus Dr, Salt Lake City, UT 84112 USA

[2] Univ Utah, Dept Bioengn, Salt Lake City, UT 84112 USA

来源：

2006 28TH ANNUAL INTERNATIONAL CONFERENCE OF THE IEEE ENGINEERING IN MEDICINE AND BIOLOGY SOCIETY, VOLS 1-15 | 2006年

关键词：

D O I：

暂无

中图分类号：

R318 [生物医学工程];

学科分类号：

0831 ;

摘要：

One requirement of a chronically implantable, wireless neural interface device is the integration of electronic circuitry with the microelectrode array. Since the electronic IC dissipates a certain amount of power, it will affect the temperature in the tissues surrounding the implant site. In this paper, the thermal influence of an integrated, 3-dimensional Utah Electrode Array, to be implanted in the brain was investigated with simulations using the finite element method (FEM). A temperature increase in the brain tissue was predicted using preliminary simulations with simplified models. The model and method used in the simulations were verified by simple in vitro experiments.

引用

页码：5677 / +

页数：3

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