Experimental investigation on heat transfer enhancement in a minichannel using CuO-water nanofluid

被引：3

作者：

Sivasubramanian, M. ^{[1
]}

Theivasanthi, T. ^{[1
]}

Manimaran, R. ^{[2
]}

机构：

[1] Kalasalingam Univ, Int Res Ctr, Krishnankoil, India

[2] Karpagam Coll Engn, Mech Dept, Coimbatore, Tamil Nadu, India

来源：

INTERNATIONAL JOURNAL OF AMBIENT ENERGY | 2019年 / 40卷 / 08期

关键词：

Microprocessor; CuO-water nanofluid; minichannel; laminar flow; heat transfer coefficient; THERMAL-CONDUCTIVITY;

D O I：

10.1080/01430750.2018.1432501

中图分类号：

TE [石油、天然气工业]; TK [能源与动力工程];

学科分类号：

0807 ; 0820 ;

摘要：

In this work, CuO-water nanofluid with an average size of nanoparticles (24?nm) and volume concentrations of 0.1% and 0.5% is used. For the computer microprocessor cooling, an aluminium minichannel of dimension (40???1???3) mm(3) is fabricated instead of an aluminium heat sink and a cooling fan. It is shown that the dispersion of nanoparticles into the distilled water has produced a considerable enhancement of the cooling of the minichannel. Experiments were conducted for Reynolds number ranging from 25 to 800 under a laminar regime. From the experiments, it is found that better heat transfer is achieved when CuO-water nanofluid is used as the working fluid.

引用

页码：847 / 853

页数：7

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