Experimental investigation on heat transfer enhancement in a minichannel using CuO-water nanofluid

被引:3
|
作者
Sivasubramanian, M. [1 ]
Theivasanthi, T. [1 ]
Manimaran, R. [2 ]
机构
[1] Kalasalingam Univ, Int Res Ctr, Krishnankoil, India
[2] Karpagam Coll Engn, Mech Dept, Coimbatore, Tamil Nadu, India
关键词
Microprocessor; CuO-water nanofluid; minichannel; laminar flow; heat transfer coefficient; THERMAL-CONDUCTIVITY;
D O I
10.1080/01430750.2018.1432501
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
In this work, CuO-water nanofluid with an average size of nanoparticles (24?nm) and volume concentrations of 0.1% and 0.5% is used. For the computer microprocessor cooling, an aluminium minichannel of dimension (40???1???3) mm(3) is fabricated instead of an aluminium heat sink and a cooling fan. It is shown that the dispersion of nanoparticles into the distilled water has produced a considerable enhancement of the cooling of the minichannel. Experiments were conducted for Reynolds number ranging from 25 to 800 under a laminar regime. From the experiments, it is found that better heat transfer is achieved when CuO-water nanofluid is used as the working fluid.
引用
收藏
页码:847 / 853
页数:7
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