Residual stresses in microelectronics induced by thermoset packaging materials during care

被引：25

作者：

Meuwissen, MHH

de Boer, HA

Steijvers, HLAH

Schreurs, PJG

Geers, MGD

机构：

[1] TNO, Ind Technol, NL-5600 HE Eindhoven, Netherlands

[2] Eindhoven Univ Technol, Dept Engn Mech, Mat Technol Inst, NL-5600 MB Eindhoven, Netherlands

来源：

MICROELECTRONICS RELIABILITY | 2004年 / 44卷 / 12期

关键词：

D O I：

10.1016/j.microrel.2004.05.001

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents a constitutive model for predicting the stresses in thermosetting resins during cure. An overview is given of the experimental techniques used for determining the parameters in this model. The model is validated by comparing its predictions to additional measurements, which have not been used for the actual parameter estimation. This validation showed that the model is capable of giving fair predictions of the measured stresses. The model is implemented in a commercially available finite element package and its use is demonstrated by applying it to the study of a flip-chip underfilling process. (C) 2004 Elsevier Ltd. All rights reserved.

引用

页码：1985 / 1994

页数：10

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