A Full X-Band Fully 3-D Printed E-Plane Rectangular-Coax-to-Waveguide Transition

被引:6
|
作者
Li, Jin [1 ]
Guo, Cheng [2 ,3 ]
Yu, Yang [3 ,4 ]
Huang, Guan-Long [1 ]
Yuan, Tao [1 ]
Wang, Yi [3 ]
Xu, Jun [5 ]
Zhang, Anxue [2 ]
机构
[1] Shenzhen Univ, Coll Informat Engn, Shenzhen 518060, Guangdong, Peoples R China
[2] Xi An Jiao Tong Univ, Dept Inf & Commun Engn, Xian 710049, Shanxi, Peoples R China
[3] Univ Birmingham, Dept EESE, Birmingham B15 2TT, W Midlands, England
[4] Southern Univ Sci & Technol, Dept EE, Shenzhen, Peoples R China
[5] UESTC, Sch Phys, Chengdu 610054, Sichuan, Peoples R China
基金
中国国家自然科学基金; 英国工程与自然科学研究理事会;
关键词
Air-filled transmission line; broadband; E-plane; rectangular coaxial line; stereolithography; 3-D printed; coax-to-waveguide transition; waveguide; MICROSTRIP TRANSITION;
D O I
10.1109/mwsym.2019.8701091
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reports on a new class of broadband fully 3-D printed E-plane rectangular-coax-to-waveguide transition. This type of transition is adopted to interconnect two E-plane rectangular waveguides, and is based on a full air-filled waveguide structure without introducing other types of transmission lines (TLs). It exhibits little dielectric loss and dispersion, and furthermore a potentially enhanced power handling capability. The transition is constructed by a section of air-filled rectangular coaxial TL cascaded in series to a broadband coax-to-waveguide probe transition. A proof-of-concept X-band back-to-back transition is designed and prototyped monolithically by incorporating stereolithography-based 3-D printing and copper electroplating techniques. The RF-measured result demonstrates a broadband and low-loss characteristic of the transition-an insertion loss of averagely 0.5 dB and a return loss of mostly better than 15 dB at the entire X band.
引用
收藏
页码:1209 / 1212
页数:4
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