Fast Memory-Efficient Full-Wave 3D Simulation of Power Planes

被引：3
|
作者：
Srinivasan, Narayanan T. V. Krishna [1 ]
Swaminathan, Madhavan [1 ]
机构：
[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
来源：
EMC 2009: IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, TECHNICAL PAPER | 2009年
关键词：
D O I：
10.1109/ISEMC.2009.5284603
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A circuit-equivalent frequency-domain electromagnetic simulation for packaging structures is proposed. Simulations are carried out using an iterative memory-efficient approach quasi-minimal residual method. The convergence of the solver is accelerated by the use of a suitable preconditioner. Results for a power-plane example, with and without aperture, are presented.
引用
收藏
页码：262 / 267
页数：6
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