Fabrication and characterization of metal-molecule-silicon devices

被引:40
|
作者
Scott, Adina [1 ]
Janes, David B.
Risko, Chad
Ratner, Mark A.
机构
[1] Purdue Univ, Birck Nanotechnol Ctr, Sch Elect & Comp Engn, W Lafayette, IN 47907 USA
[2] Northwestern Univ, Dept Chem, Evanston, IL 60208 USA
基金
美国国家科学基金会;
关键词
D O I
10.1063/1.2750516
中图分类号
O59 [应用物理学];
学科分类号
摘要
Metal-molecule-silicon (MMSi) devices have been fabricated, electrically characterized, and analyzed. Molecular layers were grafted to n and p+ silicon by electrochemical reduction of para-substituted aryl-diazonium salts and characterized using standard surface analysis techniques; MMSi devices were then fabricated using traditional silicon (Si) processing methods combined with this surface modification. The measured current-voltage characteristics were strongly dependent on both substrate type and molecular head group. The device behavior was analyzed using a qualitative model considering semiconductor depletion effects and molecular dipole moments and frontier orbital energies. (C) 2007 American Institute of Physics.
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页数:3
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