Automotive electronics - Packaging As Enabler Technology

被引：0

作者：

Knoblauch, Andreas ^{[1
]}

机构：

[1] Infineon, Package Dev Automot, Neubiberg, Germany

来源：

PROCEEDINGS OF THE 2010 34TH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY CONFERENCE (IEMT 2010) | 2011年

关键词：

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页数：2

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