Trends of the Power Electronics Devices and the Electronics Packaging; Technologies for Automotive Electronics Products

被引：0
|
作者：
Kamiya A. [1 ]
机构：
[1] Electronics Platform Hardware R&D, Div. Denso Corporation, 1-1, Showa-cho, Kariya, Aichi
来源：
Journal of Japan Institute of Electronics Packaging | 2021年 / 24卷 / 03期
关键词：
D O I：
10.5104/JIEP.24.226
中图分类号：
学科分类号：
摘要：
[No abstract available]
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