Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assemblies

被引：12
|
作者：
Lau, J [1 ]
Chang, C [1 ]
Lee, SWR [1 ]
机构：
[1] Express Packaging Syst Inc, Palo Alto, CA 94303 USA
来源：
50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS | 2000年
关键词：
D O I：
10.1109/ECTC.2000.853386
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The solder-joint reliability of a low-cast wafer-level chip scale package (WLCSP) on printed circuit board (PCB) under thermal fatigue is studied. The solder joints are subjected to thermal cycling and their crack lengths at different thermal cycles are measured. Also, the stress intensity factors at the crack tip of different crack lengths in the corner solder joint are determined by fracture mechanics with finite element method. Furthermore, an empirical equation for predicting the thermal-fatigue life of flip chip solder joints is proposed.
引用
收藏
页码：1360 / 1368
页数：3
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