Thermal-fatigue life prediction equation for wafer-level chip scale package (WLCSP) lead-free solder joints on lead-free printed circuit board (PCB)

被引：8
|
作者：
Lau, JH [1 ]
Shangguan, D [1 ]
Lau, DCY [1 ]
Kung, TTW [1 ]
Lee, SWR [1 ]
机构：
[1] Agilent Technol, Santa Clara, CA 95052 USA
来源：
54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS | 2004年
关键词：
D O I：
10.1109/ECTC.2004.1320324
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A new thermal-fatigue life prediction equation for a class of lead-free solder alloys, 95.5wt%Sn3.9-4.0wt%Ag0.5-0.6wt%Cu is proposed in this investigation. The test vehicle consists of a lead-free solder-bumped WLCSP, lead-free PCB, and lead-free solder paste. The coefficients of the fatigue equation presented herein are determined by best fitted with the isothermal fatigue data of the test vehicle. Failure modes and locations of the failed samples are discussed.
引用
收藏
页码：1563 / 1569
页数：7
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