共 50 条
- [41] Back grinding of semiconductor wafers [J]. PROGRESS OF MACHINING TECHNOLOGY: WITH SOME TOPICS IN ADVANCED MANUFACTURING TECHNOLOGY, 2002, : 301 - 306
- [42] PARTICLE DEPOSITION ON SEMICONDUCTOR WAFERS [J]. AEROSOL SCIENCE AND TECHNOLOGY, 1987, 6 (03) : 215 - 224
- [43] PHOTOREFRACTIVE IMAGING OF SEMICONDUCTOR WAFERS [J]. APPLIED PHYSICS LETTERS, 1988, 52 (13) : 1083 - 1085
- [44] FAILURE DISTRIBUTION ON SEMICONDUCTOR WAFERS [J]. CRYSTAL RESEARCH AND TECHNOLOGY, 1986, 21 (08) : 1065 - 1070
- [46] SCRIBING AND BREAKING OF SEMICONDUCTOR WAFERS [J]. SOLID STATE TECHNOLOGY, 1974, 17 (09) : 70 - 75
- [48] Electroless plating on semiconductor wafers [J]. PROCEEDINGS OF THE SYMPOSIA ON ELECTROCHEMICAL PROCESSING IN ULSI FABRICATION I AND INTERCONNECT AND CONTACT METALLIZATION: MATERIALS, PROCESSES, AND RELIABILITY, 1999, 98 (06): : 67 - 71
- [50] Detection of faulty semiconductor wafers using dynamic growing self organizing map [J]. TENCON 2005 - 2005 IEEE REGION 10 CONFERENCE, VOLS 1-5, 2006, : 761 - +