The Effect of Recrystallization on Electrical Resistivity of Stir Casted SiCP/AA6061 Composite After Shot Peening

The stir casted SiCP/AA6061 composite was selected to study the electrical resistivity after treated by using shot peening (SP) process. The composite microstructure is also seen by using optical microscopy. The SP-induced grain refinement and recrystallization were analyzed via X-ray diffraction (XRD). The SP for 140 s time achieved excellent recrystallization with orderly oriented grains, whose grain size refined to 33.7 nm from 55.4 nm before SP. The orderly arranged grains have mitigated the electron collision resulted in reduced frictional force and resistivity of the composite. The XRD peak broadening in 140 s peening is an indexing of grain refinement and exhibited resistivity of 2.88 x 10(-3) Omega-m as compared to composite before SP as 4.63 x 10(-3) Omega-m. The results confirm that SP can enhance the structural and electrical properties of SiCP/AA6061 composite.