Automatic high-density polymer waveguide layout for on-board high-speed optical interconnect

被引:0
|
作者
Huang, Zhijie [1 ]
Ma, Lin [1 ]
Kuang, Wanjing [1 ]
Shi, Ying [1 ]
He, Zuyuan [1 ]
机构
[1] Shanghai Jiao Tong Univ, State Key Lab Adv Opt Commun Syst & Networks, Shanghai 200240, Peoples R China
基金
中国国家自然科学基金; 国家重点研发计划;
关键词
optical interconnect; polymer waveguide; automatic routing; PERFORMANCE;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We demonstrate automatic polymer waveguide layout for the first time. We succeeded in 512 multimode waveguides routing with balanced performances within an area of 150x150 mm(2) by optimization on algorithm and bending radius.
引用
收藏
页数:3
相关论文
共 50 条
  • [41] Fabrication of High-Speed Optical Modulator by Hybridization of Silicon Waveguide and Organic Polymer
    Uenuma, M.
    Nojima, H.
    Motooka, T.
    [J]. 2008 5TH IEEE INTERNATIONAL CONFERENCE ON GROUP IV PHOTONICS, 2008, : 152 - 154
  • [42] High-density interconnect board design for wafer-level packaging
    Wu, B.
    Brown, B.
    Warner, E.
    [J]. ELECTRONICS LETTERS, 2011, 47 (20) : 1137 - 1138
  • [43] Plastic VCSEL array packaging and high density polymer waveguides for board and backplane optical interconnect
    Liu, YS
    Wojnarowski, RJ
    Hennessy, WA
    Piacente, PA
    Rowlette, J
    Kadar-Kallen, M
    Stack, J
    Liu, Y
    Peczalski, A
    Nahata, A
    Yardley, J
    [J]. 48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, : 999 - 1005
  • [44] The Electrical Design of High-speed and High-density ASIC Package
    Tao, Wenjun
    Li, Jun
    Zhou, Yunyan
    Wang, Qidong
    Cao, Liqiang
    Guidotti, Daniel
    Wan, Lixi
    [J]. 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 497 - 499
  • [45] HIGH-DENSITY PACKAGING TECHNIQUE FOR HIGH-SPEED MILITARY COMPUTERS
    TOLLEY, GE
    TIPTON, RW
    [J]. IEEE SPECTRUM, 1965, 2 (03) : 82 - &
  • [46] DESIGN OF HIGH-SPEED, HIGH-DENSITY CNNS IN CMOS TECHNOLOGY
    CRUZ, JM
    CHUA, LO
    [J]. INTERNATIONAL JOURNAL OF CIRCUIT THEORY AND APPLICATIONS, 1992, 20 (05) : 555 - 572
  • [47] HIGH-SPEED AND HIGH-DENSITY STATIC INDUCTION TRANSISTOR MEMORY
    NISHIZAWA, JI
    TAMAMUSHI, T
    MOCHIDA, Y
    NONAKA, T
    [J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1978, 13 (05) : 622 - 634
  • [48] Quilt packaging: High-density, high-speed interchip communications
    Bernstein, Gary H.
    Liu, Qing
    Yan, Minjun
    Sun, Zhuowen
    Kopp, David
    Porod, Wolfgang
    Snider, Greg
    Fay, Patrick
    [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2007, 30 (04): : 731 - 740
  • [49] DESIGNS MEET NEEDS OF HIGH-SPEED, HIGH-DENSITY SYSTEMS
    ORMOND, T
    [J]. EDN, 1990, 35 (14) : 50 - &
  • [50] HIGH-DENSITY MASK ROM WITH HIGH-SPEED PAGE MODE
    HOTTA, Y
    KURA, S
    OKADA, M
    TSUGITA, H
    [J]. SHARP TECHNICAL JOURNAL, 1993, (57): : 69 - 70