On critical aspects of infiltrated Al/diamond composites for thermal management: Diamond quality versus processing conditions

被引:26
|
作者
Monje, I. E. [1 ]
Louis, E. [1 ,2 ,3 ]
Molina, J. M. [1 ,4 ]
机构
[1] Univ Alicante, Inst Univ Mat Alicante, E-03080 Alicante, Spain
[2] Univ Alicante, Dept Fis Aplicada, E-03080 Alicante, Spain
[3] Univ Alicante, CSIC, Unidad Asociada, E-03080 Alicante, Spain
[4] Univ Alicante, Dept Quim Inorgan, E-03080 Alicante, Spain
关键词
Metal-matrix composites (MMCs); Interface/interphase; Thermal properties; Liquid metal infiltration; ALUMINUM-MATRIX COMPOSITES; LIQUID-METAL INFILTRATION; PRESSURE INFILTRATION; CONDUCTIVITY; CONDUCTANCE; ORIENTATION; CR;
D O I
10.1016/j.compositesa.2014.08.015
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Al/diamond composites containing diamond particles of different qualities have been manufactured by gas pressure-assisted metal infiltration and characterized by thermal conductivity (TC) measurements. The results show that the intrinsic thermal conductivity of diamond (varied with the diamond quality) plays a minor role on TC. TC is mainly governed by the Al-diamond interface characteristics, which are determined by a proper control exerted through processing conditions. Albeit a very low cost and low quality diamond is used, a high value of 667 W/m K has been measured for Al/diamond composites produced under optimized processing conditions. Values above 740 W/m K are reported for the best diamond quality explored in this work. These experimental results, which assign the control over TC mainly to the interface conductance, suggest that many of the limiting values of TC reported in literature for the different explored metal-diamond systems, need to be reconsidered by proper precise control of interface evolution. (C) 2014 Elsevier Ltd. All rights reserved.
引用
收藏
页码:70 / 76
页数:7
相关论文
共 50 条
  • [31] Decline and restrain for the thermal conductivity of diamond/Al (or AlSi alloy) composites
    Lu C.
    Xu J.
    Pei X.
    Pan X.
    Chen F.
    Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica, 2019, 36 (03): : 669 - 676
  • [32] Thermal physical properties of Al-coated diamond/Cu composites
    Congxu Zhu
    Xuliang Zhu
    Hongxiao Zhao
    Wenjun Fa
    Xiaogang Yang
    Zhi Zheng
    Journal of Wuhan University of Technology-Mater. Sci. Ed., 2015, 30 : 315 - 319
  • [33] FEM modeling of structure and properties of diamond-SiC-(Al) composites developed for thermal management applications
    Unifantowicz, P.
    Boguszewski, T.
    Ciupinski, L.
    Fortuna, E.
    Lewandowska, M.
    Vaucher, S.
    Kurzydlowski, K. J.
    1ST INTERNATIONAL CONFERENCE ON NEW MATERIALS FOR EXTREME ENVIRONMENTS, 2009, 59 : 173 - +
  • [34] Fabrication and characterization of diamond/copper composites for thermal management substrate applications
    Sun, Q
    Inal, OT
    MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 1996, 41 (02): : 261 - 266
  • [35] Critical effect and enhanced thermal conductivity of Cu-diamond composites reinforced with various diamond prepared by composite electroplating
    Wu, Yongpeng
    Luo, Jiangbo
    Wang, Yan
    Wang, Guilian
    Wang, Hong
    Yang, Zhuoqing
    Ding, Guifu
    CERAMICS INTERNATIONAL, 2019, 45 (10) : 13225 - 13234
  • [36] The effect of processing conditions on the microstructure and impact behavior of melt infiltrated Al/SiCp composites
    Zahedi, A. M.
    Javadpour, J.
    Rezaie, H. R.
    Mazaheri, Mehdi
    CERAMICS INTERNATIONAL, 2011, 37 (08) : 3335 - 3341
  • [37] Thermal conductivity and microstructure of Al/diamond composites with Ti-coated diamond particles consolidated by spark plasma sintering
    Liang, Xuebing
    Jia, Chengchang
    Chu, Ke
    Chen, Hui
    Nie, Junhui
    Gao, Wenjia
    JOURNAL OF COMPOSITE MATERIALS, 2012, 46 (09) : 1127 - 1136
  • [38] The Influence of Silicon Content on the Thermal Conductivity of Al-Si/Diamond Composites
    Zhang, Yang
    Wang, Xitao
    Wu, Jianhua
    2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, : 632 - 636
  • [39] Thermal properties of Si(Al)/diamond composites prepared by in situ reactive sintering
    Zhu, Congxu
    Ma, Nangang
    Jin, Ying
    Bai, Hua
    Ma, Yi
    Lang, Jing
    MATERIALS & DESIGN, 2012, 41 : 208 - 213