AN INTEGRATED SOLUTION FOR WAFER-LEVEL PACKAGING AND ELECTROSTATIC ACTUATION OF OUT-OF-PLANE DEVICES

被引：0

作者：

Chen, Kuan-Lin ^{[1
]}

Melamud, Renata ^{[1
]}

Wang, Shasha ^{[1
]}

Kenny, Thomas W. ^{[1
]}

机构：

[1] Stanford Univ, Stanford, CA 94305 USA

来源：

IEEE 22ND INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2009) | 2009年

关键词：

RESONATORS;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents an innovative way to integrate electrodes into our hermetic wafer-level epi-polysilicon encapsulation for out-of-plane actuated devices. The epitaxial-grown silicon encapsulation process was modified to integrate electrodes in the out-of-plane direction and realize ultra-compact packaging. The integration allows reduction of parasitic resistance by more than 180X relative to other conventional interconnects to out-of-plane electrodes. A 200 KHz "see-saw" mode resonator is demonstrated with parasitic resistance of approximately 1 Omega.

引用

页码：1071 / 1074

页数：4

共 50 条

[1] Wafer-Level Epitaxial Silicon Packaging for Out-of-Plane RF MEMS Resonators with Integrated Actuation Electrodes
Chen, Kuan-Lin
Wang, Shasha
Salvia, James C.
Melamud, Renata
Howe, Roger T.
Kenny, Thomas W.
[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (03): : 310 - 317
[2] Out-of-plane electrostatic actuation of microcantilevers
O'Shea, SJ
Lu, P
Shen, F
Neuzil, P
Zhang, QX
[J]. NANOTECHNOLOGY, 2005, 16 (04) : 602 - 608
[3] Design and wafer-level replication of a freeform curvature for polymer-based electrostatic out-of-plane actuators
Lange, Nicolas
Scheiding, Sebastian
Wippermann, Frank
Beckert, Erik
Eberhardt, Ramona
Tuennermann, Andreas
[J]. JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2013, 12 (04):
[4] Comprehensive Investigation of In-Plane and Out-of-Plane Die Shift in Flexible Fan-Out Wafer-Level Packaging Using Polydimethylsiloxane
Ouyang, Guangqi
Hanna, Amir
Benedict, Samatha
Ezhilarasu, Goutham
Alam, Arsalan
Irwin, Randall W.
Iyer, Subramanian S.
[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2022, 12 (10): : 1692 - 1701
[5] Integrated sensor wafer-level packaging
Audet, SA
Edenfeld, KM
[J]. TRANSDUCERS 97 - 1997 INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS AND ACTUATORS, DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2, 1997, : 287 - 289
[6] Wafer-level chip scale packaging: Benefits for integrated passive devices
Clearfield, HM
Young, JL
Wijeyesekera, SD
Logan, EA
[J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2000, 23 (02): : 247 - 251
[7] Wafer-level packaging
Van Driel, Willem Dirk
[J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2007, 30 (03): : 358 - 358
[8] Wafer-Level Packaging Technology for Optical Sensor Devices
Toschkoff, G.
Bodner, T.
Etschmaier, H.
Schrank, F.
[J]. 2017 IEEE 19TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2017,
[9] Study on Process Induced out-of-plane deformation for Fan-Out Wafer Level Packaging
Salahouelhadj, A.
Gonzalez, M.
Podpod, A.
Beyne, E.
[J]. 2020 IEEE 8TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2020,
[10] A novel wafer-level hermetic packaging for MEMS devices
Tsou, Chingfu
Li, Hungchung
Chang, Hsing-Cheng
[J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2007, 30 (04): : 616 - 621

← 1 2 3 4 5 →