Dynamics of chip formation during the cutting process using imaging techniques: A review

被引:11
|
作者
Nie, Guangchao [1 ]
Yang, Zhengyan [1 ]
Zhang, Dong [1 ]
Zhang, Xiaoming [1 ]
Outeiro, Jose [2 ]
Ding, Han [1 ]
机构
[1] Huazhong Univ Sci & Technol, State Key Lab Digital Mfg Equipment & Technol, Wuhan, Peoples R China
[2] HESAM Univ, Arts & Metiers Inst Technol, LaBoMaP, Cluny, France
基金
中国国家自然科学基金;
关键词
chip formation; imaging techniques; strain rate; stress; surface integrity; HIGH-SPEED PHOTOGRAPHY; ROUNDED-EDGE TOOL; RESIDUAL-STRESSES; PROCESS SIGNATURES; SURFACE INTEGRITY; DEFORMATION FIELD; KINEMATIC FIELDS; DIGITAL IMAGES; STRAIN FIELD; MECHANICS;
D O I
10.1002/msd2.12032
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Imaging techniques have been widely implemented to study the dynamics of chip formation. They can offer a direct method and a full field measurement of the cutting process, providing kinematic information of the chip formation process. In this article, the state of the art of the imaging techniques reported in the literature has been summarized and analyzed. The imaging techniques have been applied to study the chip formation mechanism, friction behavior, strain/strain rate, and stress fields. Furthermore, the study of surface integrity has been advanced by deriving the thermo-mechanical loading, subsurface deformation, and material constitutive model from the imaging technique. Finally, achievements in the area of imaging techniques have been summarized, followed by future directions for their application in the study of surface integrity.
引用
收藏
页码:27 / 49
页数:23
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