Heat Transfer Performance and Structural Optimization of a Novel Micro-channel Heat Sink

With the advent of the 5G era, the design of electronic equipment is developing towards thinness, intelligence and multi-function, which requires higher cooling performance of the equipment. Micro-channel heat sink is promising for the heat dissipation of super-thin electronic equipment. In this study, thermal resistance theoretical model of the micro-channel heat sink was first established. Then, fabrication process of the micro-channel heat sink was introduced. Subsequently, heat transfer performance of the fabricated micro-channel heat sink was tested through the developed testing platform. Results show that the developed micro-channel heat sink has more superior heat dissipation performance over conventional metal solid heat sink and it is well suited for high power LEDs application. Moreover, the micro-channel structures in the heat sink were optimized by orthogonal test. Based on the orthogonal optimization, heat dissipation performance of the micro-channel radiator was further improved.