共 50 条
- [34] Fracture of a finite piezoelectric layer with a penny-shaped crack International Journal of Fracture, 2011, 172 : 19 - 39
- [35] Measurement of thermally induced die stresses in flip chip on laminate assemblies ITHERM 2004, VOL 2, 2004, : 219 - 230
- [36] Thermally activated intermittent dynamics of creeping crack fronts along disordered interfaces Scientific Reports, 11
- [38] IMPACT-INDUCED FRACTURE IN A QUASI-ISOTROPIC LAMINATE JOURNAL OF COMPOSITES TECHNOLOGY & RESEARCH, 1987, 9 (02): : 40 - 46