Packetized on-chip interconnect communication analysis for MPSoC

被引:0
|
作者
Ye, TT [1 ]
Benini, L [1 ]
De Micheli, G [1 ]
机构
[1] Stanford Univ, Comp Syst Lab, Stanford, CA 94305 USA
关键词
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Interconnect networks play a critical role in shared memory multiprocessor systems-on-chip (MPSoC) designs. MPSoC performance and power consumption are greatly affected by the packet dataflows that are transported on the network. In this paper, by introducing a packetized on-chip communication power model, we discuss the packetization impact on MPSoC performance and power consumption. Particularly, we propose a quantitative analysis method to evaluate the relationship between different design options (cache, memory, packetization scheme, etc.) at the architectural level. From the benchmark experiments, we show that optimal performance and power tradeoff can be achieved by the selection of appropriate packet sizes.
引用
收藏
页码:344 / 349
页数:6
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