Measurements Methodology for the Reliability Evaluation of Intelligent Power Modules

被引：0
|
作者：
Cataliotti, A. [1 ]
Di Cara, D. [2 ]
Marsala, G. [2 ]
Ragusa, A. [2 ]
Tine, G. [2 ]
机构：
[1] Univ Palermo, Dep Energy Informat Engn & Math Models DEIM, Viale Sci, I-90128 Palermo, Italy
[2] CNR, ISSIA, I-90141 Palermo, Italy
来源：
2014 IEEE INTERNATIONAL INSTRUMENTATION AND MEASUREMENT TECHNOLOGY CONFERENCE (I2MTC) PROCEEDINGS | 2014年
关键词：
Electromagnetic compatibility (EMC); electrothermal effect; integrated power electronic modules;
D O I：
暂无
中图分类号：
TH7 [仪器、仪表];
学科分类号：
0804 ; 080401 ; 081102 ;
摘要：
The paper describes a measurement methodology for the reliability evaluation of new intelligent power electronics modules (IPMs). In particular, the evaluation of the IPMs immunity to radio frequency conducted disturbances has been performed, at different operating thermal conditions, designing a suitable measurement set up in a shielded room. Moreover, the thermal performances of the devices have been analyzed, setting up a proper experimental test bench. The measurements procedures are detailed described.
引用
收藏
页码：665 / 669
页数：5
相关论文
共 50 条
  • [21] Reliability of power cycling for IGBT power semiconductor modules
    Morozumi, A
    Yamada, K
    Miyasaka, T
    Seki, Y
    CONFERENCE RECORD OF THE 2001 IEEE INDUSTRY APPLICATIONS CONFERENCE, VOLS 1-4, 2001, : 1912 - 1918
  • [22] Reliability of power cycling for IGBT power semiconductor modules
    Morozumi, A
    Yamada, K
    Miyasaka, T
    Sumi, S
    Seki, Y
    IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2003, 39 (03) : 665 - 671
  • [23] New Intelligent Power Modules (R Series)
    Fuji Electr Rev, 180 (27):
  • [24] Selective Gate Driving in Intelligent Power Modules
    Brandelero, Julio
    Ewanchuk, Jeffrey
    Mollov, Stefan
    IEEE TRANSACTIONS ON POWER ELECTRONICS, 2021, 36 (01) : 898 - 910
  • [25] Trends and Opportunities in Intelligent Power Modules (IPM)
    Otsuki, Masahito
    Watanabe, Manabu
    Nishiura, Akira
    2015 IEEE 27TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & IC'S (ISPSD), 2015, : 317 - 320
  • [26] Novel Intelligent Power Modules for low-power inverters
    Majumdar, G
    Hussein, KH
    Iwasaki, M
    Kawafuji, H
    Iwagami, T
    Yoshida, H
    PESC 98 RECORD - 29TH ANNUAL IEEE POWER ELECTRONICS SPECIALISTS CONFERENCE, VOLS 1 AND 2, 1998, : 1173 - 1179
  • [27] Development of SiC diodes, power MOSFETs and intelligent power modules
    Nakamura, Takashi
    Miura, Mineo
    Kawamoto, Noriaki
    Nakano, Yuki
    Otsuka, Takukazu
    Oku-mura, Keiji
    Kamisawa, Akira
    PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2009, 206 (10): : 2403 - 2416
  • [28] A thermal modeling methodology for power semiconductor modules
    van der Broeck, Christoph H.
    Conrad, Marcus
    De Doncker, Rik W.
    MICROELECTRONICS RELIABILITY, 2015, 55 (9-10) : 1938 - 1944
  • [29] Reliability evaluation and design of intelligent switchgear controller in power distribution automation system
    Zou, JY
    Shi, YK
    Sun, FJ
    PROCEEDINGS OF THE 1ST INTERNATIONAL CONFERENCE ON RELIABILITY OF ELECTRICAL PRODUCTS AND ELECTRICAL CONTACTS, 2004, : 209 - 212
  • [30] Intelligent State Space Pruning with Local Search for Power System Reliability Evaluation
    Green, Robert C., II
    Wang, Lingfeng
    Alam, Mansoor
    2012 3RD IEEE PES INNOVATIVE SMART GRID TECHNOLOGIES EUROPE (ISGT EUROPE), 2012,
12345