Electrodeposition of copper-tin alloys using deep eutectic solvents

被引：56

作者：

Abbott, A. P. ^{[1
]}

Alhaji, A. I. ^{[1
]}

Ryder, K. S. ^{[1
]}

Horne, M. ^{[2
]}

Rodopoulos, T. ^{[2
]}

机构：

[1] Univ Leicester, Dept Chem, Mat Ctr, Leicester LE1 7RH, Leics, England

[2] CSIRO Proc Sci & Engn, Box 312, Clayton, Vic 3168, Australia

来源：

TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING | 2016年 / 94卷 / 02期

关键词：

Copper-tin electrodeposition; Deep eutectic solvents; Choline chloride; Alloy phase deposition; Brightener activity; IONIC LIQUID; SN; DEPOSITION; ALUMINUM;

D O I：

10.1080/00202967.2016.1148442

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

While alloy deposition is a frequently studied topic analysis of the alloy phases formed is a complex and often destructive process. In the current study the complex copper-tin alloy system has been studied in deep eutectic solvents using a variety of electrochemical and surface analysis techniques to determine the mechanism of alloy deposition and composition of deposits. The use of electrochemical quartz crystal microbalance is shown to enable real-time monitoring of alloy composition and the latter is shown to be very dependent upon the concentration of ions in solution. For this system X-ray diffraction was also used to study the phase behaviour of the deposits as a function of solution composition and current density. Finally it was shown for the first time that brighteners used for copper deposition in aqueous solutions also work in ionic liquids.

引用

页码：104 / 113

页数：10

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