A thermally-resilient all-optical network-on-chip

被引:6
|
作者
Karimi, Roshanak [1 ]
Koohi, Somayyeh [1 ]
Tinati, Melika [1 ]
Hessabi, Shaahin [1 ]
机构
[1] Sharif Univ Technol, Dept Comp Engn, Tehran 111559517, Iran
关键词
Multi-core/single-chip multiprocessors; On-chip interconnection networks; Fault-resiliency; Temperature-aware design; SILICON; NOC;
D O I
10.1016/j.microrel.2019.05.017
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Optical networks-on-chip are introduced as an alternative for electrical interconnects in many-core systems, due to their low delay and power consumptions, as well as their high bandwidths. Despite these advantages, physical characteristics of the photonic components are highly sensitive to thermal variations, which results in optical data misrouting through the optical networks at the presence of temperature fluctuation. In this paper, we propose a thermally-resilient all-optical communication approach which improves reliability, as well as performance of the optical networks. For this purpose, we take advantages of auxiliary waveguides and a novel wavelength assignment approach to avoid optical data routing through the hot regions. In this manner, each node is provided with an alternative path to resend the misrouted optical data in the case of fault occurrence. A novel all-optical Mesh-based architecture is opted for the proposed thermally-resilient optical communication approach, as well as the well-known lambda-router, as direct and indirect all-optical non-blocking networks, respectively. Simulation results verify the prominence of the proposed reliable Mesh-based architecture against alternative architecture, in terms of network performance, thermal resilience, and throughput.
引用
收藏
页码:74 / 86
页数:13
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