3D Heterogeneous Package Integration of Air/Magnetic Core Inductor: 89%-Efficiency Buck Converter with Backside Power Delivery Network

被引：0

作者：

Sun, Xiao ^{[1
]}

Lin, Hesheng ^{[1
,2
]}

Velenis, Dimitrios ^{[1
]}

Slabbekoorn, John ^{[1
]}

Talmelli, Giacomo ^{[1
,2
]}

Bex, Pieter ^{[1
]}

Sterken, Tom ^{[1
]}

Lauwereins, Rudy ^{[1
,2
]}

Adelmann, Christoph ^{[1
]}

Miller, Andy ^{[1
]}

Van der Plas, Geert ^{[1
]}

Beyne, Eric ^{[1
]}

机构：

[1] IMEC, Leuven, Belgium

[2] Katholieke Univ Leuven, Leuven, Belgium

来源：

2020 IEEE SYMPOSIUM ON VLSI TECHNOLOGY | 2020年

关键词：

D O I：

10.1109/vlsitechnology18217.2020.9265045

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

We demonstrate a novel concept of integrating 110-mu m-thick low-resistance high-Q magnetic core inductors in fan-out wafer level packaging (FOWLP). Unlike thin-film magnetic core inductors [1], this solution offers the possibility to embed thick cores to meet power density requirements, allowing for 89% efficiency at 1.2 W/mm(2) power density for 2:1 power conversion with a backside power delivery network (BSPDN) using circular-shaped magnetic inductors.

引用

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页数：2

共 14 条

[1] Modeling of Buck Converter with 3D Air-Core Inductor
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