Effect of isopropyl alcohol on cathodic deposition of ultradispersed copper-containing powders from electrolyte solutions

被引：8
|
作者：
Chulovskaya, S. A. [1 ]
Parfenyuk, V. I.
机构：
[1] Russian Acad Sci, Inst Solut Chem, Ivanovo, Russia
[2] Ivanovo State Univ Chem Engn, Ivanovo, Russia
来源：
RUSSIAN JOURNAL OF APPLIED CHEMISTRY | 2007年 / 80卷 / 06期
关键词：
D O I：
10.1134/S1070427207060158
中图分类号：
O69 [应用化学];
学科分类号：
081704 ;
摘要：
The possibility of cathodic deposition of copper-containing powders of nanosize dispersity from solutions of copper dichloride in a mixed water-isopropanol solvent was studied.
引用
收藏
页码：930 / 933
页数：4
相关论文
共 50 条
  • [41] POTENTIAL-SELECTIVE DEPOSITION OF COPPER FROM SOLUTIONS CONTAINING IRON AND COMPLEXED WITH CHLORIDE
    WHITE, R
    TRAINHAM, JA
    NEWMAN, J
    CHAPMAN, TW
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1976, 123 (08) : C265 - C265
  • [42] EFFECT OF THE BASE STRENGTH ON DEPOSITION OF BASIC COPPER(II) SULFATES FROM SOLUTIONS
    GYUNNER, EA
    YAKHKIND, ND
    TSAREVA, AI
    TEMNAYA, IB
    ZHURNAL NEORGANICHESKOI KHIMII, 1991, 36 (01): : 64 - 68
  • [43] Laser-induced deposition of nanostructured copper tracks from solutions containing oxidising additives
    Fateev, Sergey A.
    Araslanova, Svetlana M.
    Mironov, Vasilii S.
    Gordeychuk, Dmitrii I.
    THIRD INTERNATIONAL SYMPOSIUM ON LASER INTERACTION WITH MATTER, 2015, 9543
  • [44] Copper Deposition from Chloride-Containing Aqueous Solutions: Catalysis and the Role of the Water Structure
    Colombo, Estefania
    Belletti, Gustavo D.
    Fonseca, Sarah
    Pinto, Leandro M. C.
    Juarez, M. Fernanda
    Nazmutdinov, Renat
    Santos, Elizabeth
    Schmickler, Wolfgang
    Quaino, Paola
    JOURNAL OF PHYSICAL CHEMISTRY C, 2021, 125 (03): : 1811 - 1818
  • [45] ABSORPTION MECHANISM OF MOLECULAR-OXYGEN FROM ETHYLENE-GLYCOL AQUEOUS-SOLUTIONS, USING COPPER-CONTAINING REDOXITES
    SHCHEDRINA, VB
    KRAVCHENKO, TA
    SHATALOV, AY
    ZHURNAL FIZICHESKOI KHIMII, 1981, 55 (06): : 1585 - 1586
  • [46] Co-deposition of copper and tin from acidic sulfate solutions containing polyether laprol 2402C:: The effect of halides
    Survila, A
    Mockus, Z
    Kanapeckaité, S
    Jasulaitiené, V
    RUSSIAN JOURNAL OF ELECTROCHEMISTRY, 2004, 40 (08) : 855 - 859
  • [47] Co-deposition of Copper and Tin from Acidic Sulfate Solutions Containing Polyether Laprol 2402C: The Effect of Halides
    A. Survila
    Z. Mockus
    S. Kanapeckaitė
    V. Jasulaitienė
    Russian Journal of Electrochemistry, 2004, 40 : 855 - 859
  • [48] EFFECT OF SOME ADDENDS ON ELECTROLYTIC DEPOSITION AND STRUCTURE OF COPPER COATINGS FROM ACID SOLUTIONS
    STOICHEV, DS
    RASHKOV, S
    DOKLADI NA BOLGARSKATA AKADEMIYA NA NAUKITE, 1973, 26 (02): : 243 - 246
  • [49] Deposition rate and morphology of electroless copper film from solutions containing 2,2'-dipyridyl
    Oita, M
    Matsuoka, M
    Iwakura, C
    ELECTROCHIMICA ACTA, 1997, 42 (09) : 1435 - 1440
  • [50] Electroless Deposition of Bismuth Containing Films on Copper and Silver Substrates from KBiI4 Solutions
    Djokic, S. S.
    Prashanthi, K.
    Thundat, T.
    ELECTROCHEMICAL AND SOLID STATE LETTERS, 2012, 15 (05) : D23 - D25
12345