Improved InP-based double heterojunction bipolar transistors

被引:0
|
作者
Lin, Y. S. [1 ]
Huang, J. H. [1 ]
Ho, C. H. [1 ]
机构
[1] Natl Dong Hwa Univ, Dept Mat Sci & Engn, 1,Sec 2,Da Hsueh Rd, Shoufeng 974, Hualien, Taiwan
关键词
D O I
10.1002/pssc.200674254
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This article develops two double heterostructure bipolar transistors (DHBTs) made by low-pressure metamorphic organic chemical vapor deposition (LP-MOCVD). One is a control DHBT with an abrupt base-collector heterojunction (abrupt DHBT) and the other is an improved DHBT with a composite-collector design (composite DHBT). Of the devices with no ledge passivation, the composite DHBT has a high common-emitter current gain, a low offset voltage and voltage-independent collector current characteristics, unlike the abrupt DHBT. The favorable performance of the composite DHBT follows mainly from the optimal collector design, which effectively lowers the potential spike at the base-collector heterojunction. Furthermore, measurements of the composite DHBT with and without n-InP emitter ledges are made. The composite DHBT with emitter ledges has a current gain of 180, which is 44% higher than that of the device with no emitter ledge. The higher current gain is attributable to the lower base surface recombination current in the composite DHBT with a ledge. The effectiveness of the composite-collector design and the emitter ledge process of the presented DHBT is proven. (c) 2007 WILEY-VCH Verlag GmbH & Co. KGaA. Weinheim.
引用
收藏
页码:1680 / +
页数:3
相关论文
共 50 条
  • [21] Analysis of high current effects on the performance of Pnp InP-based heterojunction bipolar transistors
    Datta, S.
    Roenker, K.P.
    Peddenpohl II, R.E.
    Cahay, M.M.
    Conference Proceedings - International Conference on Indium Phosphide and Related Materials, 2000, : 134 - 137
  • [22] Two-Dimensional Physical and Numerical Modelling of InP-based Heterojunction Bipolar Transistors
    Tauqeer, T.
    Sexton, J.
    Amir, F.
    Missous, M.
    ASDAM 2008, CONFERENCE PROCEEDINGS, 2008, : 271 - 274
  • [23] Base pushout and high current effects in InP-based Pnp heterojunction bipolar transistors
    Datta, S
    Roenker, KP
    Cahay, MM
    STATE-OF-THE-ART PROGRAM ON COMPOUND SEMICONDUCTORS (SOTAPOCS XXXI), 1999, 99 (17): : 185 - 197
  • [24] InP-based heterojunction bipolar transistors with InGaAs/GaAs strained-layer-superlattice
    Driad, R.
    Aidam, R.
    Yang, Q.
    Maier, M.
    Guellich, H.
    Schlechtweg, M.
    Ambacher, O.
    APPLIED PHYSICS LETTERS, 2011, 98 (04)
  • [25] Analysis of high current effects on the performance of Pnp InP-based heterojunction bipolar transistors
    Datta, S
    Roenker, KP
    Peddenpohl, RE
    Cahay, MM
    2000 INTERNATIONAL CONFERENCE ON INDIUM PHOSPHIDE AND RELATED MATERIALS, CONFERENCE PROCEEDINGS, 2000, : 134 - 137
  • [26] High current and two dimensional effects in InP-based Pnp heterojunction bipolar transistors
    Datta, S
    Roenker, KP
    Cahay, MM
    COMPOUND SEMICONDUCTOR POWER TRANSISTORS AND STATE-OF-THE-ART PROGRAM ON COMPOUND SEMICONDUCTORS (SOTAPOCS XXIX), 1998, 98 (12): : 293 - 303
  • [27] Simulation study of InP-based PNP heterojunction bipolar transistors and incorporation of nonclassical effects
    Shi, S
    Roenker, KP
    Kumar, T
    Cahay, MM
    Stanchina, WE
    SUPERLATTICES AND MICROSTRUCTURES, 1995, 18 (01) : 9 - 19
  • [28] Atomic force microscopy analysis of orientation effect on InP-based heterojunction bipolar transistors
    Sachelarie, D.
    Stanciu, S. G.
    Stanciu, G. A.
    2007 ICTON MEDITERRANEAN WINTER CONFERENCE, 2007, : 188 - 189
  • [29] Design and performance of InP/GaAsSb/InP double heterojunction bipolar transistors
    Dvorak, MW
    Matine, N
    Bolognesi, CR
    Xu, XG
    Watkins, SP
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 2000, 18 (02): : 761 - 764
  • [30] An approach to determine small-signal model parameters for InP-based heterojunction bipolar transistors
    Gao, JJ
    Li, XP
    Wang, H
    Boeck, G
    IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2006, 19 (01) : 138 - 145