Self-assembled metal/molecule/semiconductor nanostructures for electronic device and contact applications

被引:14
|
作者
Janes, DB [1 ]
Lee, T
Liu, J
Batistuta, M
Chen, NP
Walsh, BL
Andres, RP
Chen, EH
Melloch, MR
Woodall, JM
Reifenberger, R
机构
[1] Purdue Univ, Sch Elect & Comp Engn, W Lafayette, IN 47907 USA
[2] Purdue Univ, Dept Phys, W Lafayette, IN 47907 USA
[3] Purdue Univ, Sch Chem Engn, W Lafayette, IN 47907 USA
[4] Purdue Univ, NSF, MRSEC Technol Enabling Heterostruct Mat, W Lafayette, IN 47907 USA
关键词
self-assembly; nanocluster; ohmic contact; GaAs; STM;
D O I
10.1007/s11664-000-0046-z
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We report a fabrication approach in which we combine self-assembled metal/molecule nanostructures with chemically stable semiconductor surface layers. The resulting structures have well controlled dimensions and geometries (similar to 4 nm Au nanoclusters) provided by the chemical self-assembly and have stable, low-resistance interfaces realized by the chemically stable semiconductor cap layer (low-temperature grown GaAs passivated by the organic tether molecules). Scanning tunneling microscope imaging and current-voltage spectroscopy of nanocontacts to n-GaAs fabricated using this approach indicate high quality, ohmic nanocontacts having a specific contact resistance of similar to 1 x 10(-7) Omega . cm(2) and a maximum current density of similar to 1 x 10(7) A/cm(2), both comparable to those observed in large area contacts. Uniform 2-D arrays of these nanocontact structures have been fabricated and characterized as potential cells for nanoelectronic device applications.
引用
收藏
页码:565 / 569
页数:5
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