Path Delay Test in the Presence of Multi-Aggressor Crosstalk, Power Supply Noise and Ground Bounce

被引:0
|
作者
Asokan, A. [1 ]
Todri-Sania, A. [1 ]
Bosio, A. [1 ]
Dilillo, L. [1 ]
Girard, P. [1 ]
Pravossoudovitch, S. [1 ]
Virazel, A. [1 ]
机构
[1] Univ Montpellier 2, CNRS, LIRMM, Montpellier, France
关键词
automatic test pattern generation (ATPG); ground bounce; multi-aggressor crosstalk; path delay variations; power supply noise; X-bit filling; PATTERN GENERATION; UNCORRELATED POWER;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Physical Design (PD) issues are becoming a major challenge with technology scaling in integrated circuits. Multi-aggressor crosstalk, power supply noise and ground bounce are some of the PD issues that cause considerable path delay variations. Therefore, these PD issues need to be considered during path delay testing to ensure better delay defect coverage. In this paper, we first show that the path delay Automatic Test Pattern Generation (ATPG) test methods are incapable of generating an input pattern that can capture worst-case path delay in circuits. We, then present our Physical Design Aware Pattern Generation (PDAPG) method to generate an input test pattern that can capture worst-case path delay in the presence of PD issues. We propose a backtrace X-filling approach to identify the relevant X-bits causing worst-case path delay. Simulations performed on ITC'99 benchmark circuits show that our PDAPG method is capable of providing high quality input test patterns in comparison with conventional path delay ATPG test methods.
引用
收藏
页码:207 / 212
页数:6
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  • [1] Multi-aggressor relative window method for timing analysis including crosstalk delay degradation
    Sasaki, Y
    Yano, K
    [J]. PROCEEDINGS OF THE IEEE 2000 CUSTOM INTEGRATED CIRCUITS CONFERENCE, 2000, : 495 - 498
  • [2] A Study of Path Delay Variations in the Presence of Uncorrelated Power and Ground Supply Noise
    Todri, A.
    Bosio, A.
    Dilillo, L.
    Girard, P.
    Pravossoudovitch, S.
    Virazel, A.
    [J]. 2011 IEEE 14TH INTERNATIONAL SYMPOSIUM ON DESIGN AND DIAGNOSTICS OF ELECTRONIC CIRCUITS AND SYSTEMS (DDECS), 2011, : 189 - 194
  • [3] Uncorrelated Power Supply Noise and Ground Bounce Consideration for Test Pattern Generation
    Todri, Aida
    Bosio, Alberto
    Dilillo, Luigi
    Girard, Patrick
    Virazel, Arnaud
    [J]. IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2013, 21 (05) : 958 - 970
  • [4] Robust test generation for power supply noise induced path delay faults
    Fu, Xiang
    Li, Huawei
    Hu, Yu
    Li, Xiaowei
    [J]. 2008 ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE, VOLS 1 AND 2, 2008, : 625 - 628
  • [5] Path delay test generation for domino logic circuits in the presence of crosstalk
    Kundu, R
    Blanton, RD
    [J]. INTERNATIONAL TEST CONFERENCE 2003, PROCEEDINGS, 2003, : 122 - 130
  • [6] Buffer delay change in the presence of power and ground noise
    Chen, LH
    Marek-Sadowska, M
    Brewer, F
    [J]. IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2003, 11 (03) : 461 - 473
  • [7] Estimating Power Supply Noise and Its Impact on Path Delay
    Rao, Sushmita Kadiyala
    Sathyanarayana, Chaitra
    Kallianpur, Ajay
    Robucci, Ryan
    Patel, Chintan
    [J]. 2012 IEEE 30TH VLSI TEST SYMPOSIUM (VTS), 2012, : 276 - 281
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    Tehranipoor, Mohammad
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    Robucci, Ryan
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    [J]. PROCEEDINGS OF THE 2013 IEEE INTERNATIONAL SYMPOSIUM ON DEFECT AND FAULT TOLERANCE IN VLSI AND NANOTECHNOLOGY SYSTEMS (DFTS), 2013, : 272 - 277
  • [10] Examining Timing Path Robustness Under Wide-Bandwidth Power Supply Noise Through Multi-Functional-Cycle Delay Test
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