WORLD'S FIRST 5G MM-WAVE ULTRA-WIDEBAND DUAL POLARIZATION ANTENNA USING STACKABLE PACKAGING - SMARTPOSER™

被引：0
|
作者：
Lin, Cheng Chung [1 ]
Wu, Cheng Tar [1 ]
Chen, Yen Heng [1 ]
Zhou, Dirk [1 ]
Lv, Jiao [1 ]
Qiu, Yuedong [1 ]
Huang, Leslie [1 ]
Qian, ZhanYi [2 ]
Yu, Bin [2 ]
Lin, Johnson [1 ]
机构：
[1] SJ Semicond Corp, Jiangyin City 214437, Jiangsu, Peoples R China
[2] Speed Wireless Technol Co Ltd, Suzhou 215122, Jiangsu, Peoples R China
来源：
2019 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC) | 2019年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
SmartPoser (TM), a 3D-SiP platform of integrating the entire power delivery subsystem into the package will be unveiled. SmartPoser (TM) can accommodate the active power dies and passive SMT components directly underneath the computing die in a 3D stack by using non-TSV Vertical-InterConnect (V-IC) technology. The SmartPoser (TM) platform has successfully realized a novel 5G mm-Wave ultra-wideband AiP for the first time in semiconductor history named SmartAiP (TM). The SmartAiP (TM) features ultra-wideband from 25GHz to 43GHz and high gain (max 12.5dB broadside) characteristics. The low return loss performance in ultra-wideband is owing to precise wafer-level processing. Further tweak to enclose the 24GHz with low return loss coverage when integrated with transceiver is expected from simulation.
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页数：3
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