Short-circuit diffusion of nickel in the intermetallic compound Ni3Ga

被引：1
|
作者：
Cermák, J
Ruzicková, J
Konecny, M
Ipser, H
机构：
[1] Acad Sci Czech Republic, Inst Phys Mat, CZ-61662 Brno, Czech Republic
[2] Univ Vienna, Inst Anorgan Chem, A-1090 Vienna, Austria
来源：
SCRIPTA MATERIALIA | 2000年 / 43卷 / 03期
基金：
奥地利科学基金会;
关键词：
intermetallics; interface diffusion;
D O I：
10.1016/S1359-6462(00)00395-X
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
The diffusion of nickel in the intermetallic compound Ni3Ga was investigated. The compound showed similarities with Ni3Al both in its fracture behavior and the ductilizing effect of boron. The atomic size and electronegativity factors also affected the diffusion mechanism.
引用
收藏
页码：227 / 232
页数：6
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