Finite element analysis of a three-dimensional package

被引：34
|
作者：
Zhong, Z [1 ]
Yip, PK [1 ]
机构：
[1] Nanyang Technol Univ, Singapore 2263, Singapore
来源：
SOLDERING & SURFACE MOUNT TECHNOLOGY | 2003年 / 15卷 / 01期
关键词：
flip chip; fatigue; solder joints; finite element analysis;
D O I：
10.1108/09540910310455680
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A three-dimensional (3D) package consisting of a stack of three silicon chips was conceptually designed. A finite element simulation of this 3D package was conducted in order to compare the fatigue lives of the solder joints with those in a typical single flip chip package when subjected to a cyclic thermal loading. It was found that the proposed design of the 3D package was feasible in terms of its mechanical deformation response to the thermal cycle.
引用
收藏
页码：21 / 25
页数：5
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