Finite element analysis of a three-dimensional package

被引：34

作者：

Zhong, Z ^{[1
]}

Yip, PK ^{[1
]}

机构：

[1] Nanyang Technol Univ, Singapore 2263, Singapore

来源：

SOLDERING & SURFACE MOUNT TECHNOLOGY | 2003年 / 15卷 / 01期

关键词：

flip chip; fatigue; solder joints; finite element analysis;

D O I：

10.1108/09540910310455680

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A three-dimensional (3D) package consisting of a stack of three silicon chips was conceptually designed. A finite element simulation of this 3D package was conducted in order to compare the fatigue lives of the solder joints with those in a typical single flip chip package when subjected to a cyclic thermal loading. It was found that the proposed design of the 3D package was feasible in terms of its mechanical deformation response to the thermal cycle.

引用

页码：21 / 25

页数：5

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