Adhesion of Pt/Ti thin films on poly-Si/SiO2/Si and SiO2/Si substrates

被引：0
|
作者：
Kang, UB [1 ]
Kim, YH [1 ]
机构：
[1] Hanyang Univ, Dept Mat Engn, Seoul 133791, South Korea
来源：
JOURNAL OF THE KOREAN PHYSICAL SOCIETY | 1998年 / 32卷
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D O I：
暂无
中图分类号：
O4 [物理学];
学科分类号：
0702 ;
摘要：
The adhesion of Pt/Ti thin films has been investigated by using the adhesive tape test, the peel test, and the scratch test. Pt/Ti thin films were deposited onto SiO2/Si and poly-Si/SiO2/Si substrates using DC magnetron sputtering, followed by annealing in Oz at various temperatures. Extensive interdiffusion was found during annealing. The PtSi and TiSi silicides were formed in the Pt/Ti/poly-Si specimens when the specimen was annealed at high temperature. The quantitative analysis on the adhesion was successful. As-deposited specimens had strong adhesion regardless of type of the substrates. Annealing decreased the adhesion strength in both specimens. The degradation of adhesion was related to the silicide formation in the Pt/Ti/poly-Si specimens and the TiO2 formation in the Pt/Ti/SiO2 specimens.
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页码：S1448 / S1450
页数：3
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