Microstructures of rapidly solidified Cu-Hf alloys

被引:0
|
作者
Kuznicka, B
Haimann, K
Dudzinski, W
机构
来源
SOLIDIFICATION AND GRAVITY | 1996年 / 215卷
关键词
rapid solidification; copper alloys; age hardening; electrical conductivity;
D O I
10.4028/www.scientific.net/MSF.215-216.51
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Rapidly quenched Cu-Hf alloys were prepared by melt spinning as 35-55 mu m thick ribbons and microstructure was examined as a function of alloy content and subsequent ageing. It was found that up to about 0.3 at.%Hf can be retained in solid solution across entire ribbon thickness. At higher alloying contents two morphologically different zones were formed across ribbon section. Increase in hafnium content or addition of chromium and silver improved thermal stability of microstructure which allowed maintaining good properties after high temperature annealing.
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页码:51 / 57
页数:7
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