Adaptive bonding technique for precise assembly of three-dimensional microstructures

被引:6
|
作者
Park, Sang-Hu
Jeong, Jun-Ho [1 ]
Choi, Dae-Geun
Kim, Ki-Don
Altun, Ali Ozhan
Lee, Eung-Sug
Yang, Dong-Yol
Lee, Kwang-Sup
机构
[1] Korea Inst Machinery & Mat, Nanomech Syst Res Ctr, Taejon 305343, South Korea
[2] Pusan Natl Univ, Sch Mech Engn, Pusan 609735, South Korea
[3] Korea Adv Inst Sci & Technol, Dept Mech Engn, Taejon 305701, South Korea
[4] Hannam Univ, Dept Polymer Sci & Engn, Taejon 306791, South Korea
关键词
D O I
10.1063/1.2746085
中图分类号
O59 [应用物理学];
学科分类号
摘要
Precise fabrication of three-dimensional (3D) self-standing microstructures on thin glass plates via two-photon induced polymerization (TPP) has been an important issue for innovative 3D nanodevices and microdevices. However, there are still issues remaining to be solved, such as building 3D microstructures on opaque materials via TPP and being able to implant them as functional parts onto practical systems. To settle these issues simply and effectively, the authors propose a contact print lithography (CPL) method using an ultraviolet-curable polymer layer. They report some of the possibilities and potential of CPL by presenting their results for transplanting 3D microstructures onto large-area substrates and also their examination of some of the effects of the process parameters on CPL. (c) 2007 American Institute of Physics.
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页数:3
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