Formation of microstructure in Ag-In-Sn solder alloys

被引：1
|
作者：
Snugovsky, L.
Snugovsky, P.
Perovic, D. D.
Rutter, J. W.
机构：
[1] Univ Toronto, Toronto, ON M5S 3E4, Canada
[2] Celestica Inc, Toronto, ON M3C 1V7, Canada
来源：
MATERIALS SCIENCE AND TECHNOLOGY | 2007年 / 23卷 / 04期
关键词：
solder alloy; Pb-free; Ag-In-Sn system;
D O I：
10.1179/174328407X176901
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A metallographic study is reported of the phases and reactions that occur in Ag-In-Sn (Pb-free) solder alloys containing approximately 3 wt-%Ag and up to 10 wt-%In. Specimens were prepared by very slow unidirectional solidification and as small castings. Three different intermetallic compound phases and two different matrix phases were observed, depending on the In content of the alloy. The probable reactions that produce these phases are discussed and compared with data from the published ternary liquidus projection. This study was carried out in the Department of Materials Science and E-ngineering, University of Toronto, as part of the CMAP program.
引用
收藏
页码：432 / 437
页数：6
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