Investigation of the thermal properties of a linear array of laser diodes on a silicon carbide heat sink

被引：3

作者：

Apollonov, VV

Babayants, GI

Gruden, MN

Derzhavin, SI

Kazakov, AA

Kishmakhov, BS

Koval, YP

Kuz'minov, VV

Mashkovskii, DA

Prokhorov, AM

Smekalin, VP

Timoshkin, VN

机构：

[1] Russian Acad Sci, Inst Gen Phys, Moscow 117942, Russia

[2] Polyus Sci & Ind Assoc, Moscow 117342, Russia

[3] Luch Sci & Ind Assoc, Moscow, Russia

来源：

QUANTUM ELECTRONICS | 1997年 / 27卷 / 10期

关键词：

D O I：

10.1070/QE1997v027n10ABEH001076

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An investigation was made of the operating characteristics of a linear array of AlGaAs laser diodes indium-soldered to an SiC heat sink. The average output power was 14 W and the efficiency was similar to 25%. The thermal impedance of the system was 0.05 K W-1. A comparison of the experimental results with heat flow fluctuations showed that, in spite of a thick solder layer, the system was capable of draining heat at an average rate twice that detected experimentally, The discrepancy between the experimental and theoretical results could be explained by structural imperfections of the solder layer, typical of the adopted method for bonding a linear diode array to a heat sink and to electrodes.

引用

页码：845 / 849

页数：5

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