Advanced Dicing Technologies for Combination of Wafer to Wafer and Collective Die to Wafer Direct Bonding

被引：18

作者：

Inoue, Fumihiro ^{[1
]}

Phommahaxay, Alain ^{[1
]}

Podpod, Arnita ^{[1
]}

Suhard, Samuel ^{[1
]}

Sleeckx, Erik ^{[1
]}

Rebibis, Kenneth June ^{[1
]}

Miller, Andy ^{[1
]}

Beyne, Eric ^{[1
]}

Hoshino, Hitoshi ^{[2
]}

Moeller, Berthold ^{[2
]}

机构：

[1] Imec, Kapeldreef 75, B-3001 Leuven, Belgium

[2] Disco Hitech Europe GmbH, Liebigstr 8, D-85551 Kirchheim, Germany

来源：

2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2019年

关键词：

component; Dicing; collective die-to-wafer bonding; hybrid bonding;

D O I：

10.1109/ECTC.2019.00073

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Feasibility study of alternative dicing technologies for collective die to wafer direct bonding combined with wafer to wafer direct bonded dies has been performed. Several dicing technologies such as blade dicing, laser grooving + plasma dicing, laser grooving + stealth dicing and laser grooving from backside were evaluated for this integration scheme. For the case of blade diced dies, the collective die to wafer direct bonding are not succeeded. This was due to particle interruption, caused by remaining particles from dicing. For the case of laser grooving + plasma dicing and laser grooving from backside, successful die to wafer direct bonding were observed. However, the die edge was not bonded for the case of laser grooving + stealth dicing. This was attributed to the occurrence of the laser recast caused during laser grooving. Based on the characterization of dicing techniques for this approach, we have achieved successful integration of collective die to wafer bonding combined with wafer to wafer bonded dies.

引用

页码：437 / 445

页数：9

共 50 条

[21] Superjunction by wafer direct bonding
Yamaguchi, Hitoshi, 1600, JJAP, Minato-ku, Japan (34):
[22] Wafer and Die Bonding Technologies for 3D Integration
Farrens, Shari
MATERIALS AND TECHNOLOGIES FOR 3-D INTEGRATION, 2009, 1112 : 55 - 65
[23] International conference on wafer bonding for MEMS technologies and wafer level integration
Knechtel, Roy
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2018, 24 (01): : 771 - 771
[24] International conference on wafer bonding for MEMS technologies and wafer level integration
Roy Knechtel
Microsystem Technologies, 2018, 24 : 771 - 771
[25] The Challenges of Wafer Blade Dicing by Minimize Die Size
Wu, Yongbing
Yuan, Liana
Xia, Hongbin
2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2024,
[26] Wafer Dicing Vibration Investigation on Novel Wafer Mounting Techniques
Amri, Mohd Syahrin
Omar, Ghazali
Mispan, Mohd Syafiq
Harun, Fuaida
Othman, M. N. B.
Ngatiman, N. A.
Ibrahim, Masrullizam Mat
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2024, 37 (04) : 583 - 590
[27] CHEMICAL FREE ROOM-TEMPERATURE WAFER TO WAFER DIRECT BONDING
FARRENS, SN
DEKKER, JR
SMITH, JK
ROBERDS, BE
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1995, 142 (11) : 3949 - 3955
[28] Wafer contamination protection by direct wafer bonding and air jet debonding
Alexe, M
Gösele, U
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY, AND APPLICATIONS V, PROCEEDINGS, 2001, 99 (35): : 195 - 199
[29] Direct Die to Wafer Cu Hybrid Bonding for Volume Production
Fan, Chun Ho
Ng, Hoi Ping
So, Siu Cheung
Man, Ngai Tat
Lee, Chi Yung
Li, Ming
Uhrmann, Thomas
Burggraf, Juergen
Pires, Mariana
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC, 2023, : 91 - 96
[30] Effects of wafer cleaning and annealing on glass/silicon wafer direct bonding
Min, HS
Joo, YC
Song, OS
JOURNAL OF ELECTRONIC PACKAGING, 2004, 126 (01) : 120 - 123

← 1 2 3 4 5 →