The interaction of Sn-Ag and Sn-Ag-Cu solder balls with BGA bond pad

被引：0
|
作者：
Lin, KL [1 ]
Chen, WL [1 ]
Hou, CC [1 ]
Chow, HK [1 ]
Tu, CT [1 ]
机构：
[1] Natl Cheng Kung Univ, Tainan 70101, Taiwan
来源：
ADVANCED ELECTRONICS ASSEMBLY - A SYMPOSIUM ON LEAD FREE INTERCONNECT TECHNOLOGY, PROCEEDINGS OF THE TECHNICAL PROGRAM | 2000年
关键词：
Pb-free solder; thermal cycling; intermetallic compound; ball grid array;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The most common material currently used to make BGA solder spheres is eutectic 63Sn-37Pb alloy since its physical properties fit well in the process of BGA packaging. Unfortunately, lead is harmful to the world's environment and is toxic to the human body. Legislatures in Europe as well as in Japan is working on the laws to band leaded solder in the near future. Many Japanese companies started timely to phase out the use of leaded solders. At present, applying lead free solder spheres in BGA packaging is only in the beginning stage and their behaviors are yet to be determined. Sn-Ag and Sn-Ag-Cu are among the most popular solder materials being investigated. It is the purpose of this paper to investigate the interaction of 96.5Sn-3.5Ag and 95.75Sn-3.5%Ag-0.75%Cu solder spheres with the Au/Ni/Cu bond pad on BGA substrate. Cu of the solder was found to significantly enhance the formation of intermetallic compound (IMC). The IMC was mainly formed between Ni and Sn with dissolution of Cu. The incorporation of Cu with Sn-Ag solder may enhance crack growth.
引用
收藏
页码：47 / +
页数：6
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