Gate Bias Stress-Induced Threshold Voltage Shift Effect of a-IGZO TFTs with Cu Gate

被引:26
|
作者
Liu, Xiang [1 ,2 ]
Wang, Lisa Ling [3 ]
Ning, Ce [2 ]
Hu, Hehe [2 ]
Yang, Wei [2 ]
Wang, Ke [2 ]
Yoo, Seong Yeol [2 ]
Zhang, Shengdong [1 ,3 ]
机构
[1] Peking Univ, Inst Microelect, Beijing 100871, Peoples R China
[2] BOE Technol Grp Co Ltd, Technol Res Inst, Beijing 100176, Peoples R China
[3] Peking Univ, Shenzhen Grad Sch, Sch Elect & Comp Engn, Shenzhen 518055, Peoples R China
关键词
Amorphous indium gallium zinc oxide thin-film transistors (a-IGZO TFTs); copper diffusion; copper gate; stacked gate insulator; threshold voltage shift; THIN-FILM TRANSISTORS;
D O I
10.1109/TED.2014.2362850
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The gate bias stress-induced threshold voltage shift effect of amorphous indium gallium zinc oxide thin-film transistors (a-IGZO TFTs) with Cu gate is investigated in this brief. It is revealed that the Cu-gated TFTs with SiOx gate insulator suffer from serious electrical performance degradation under gate bias stress owing to Cu diffusion into the gate insulator and channel region. A stacked gate insulator of SiOx/SiNx is then proposed to suppress the Cu diffusion. Experimental results show that the Cu-gated TFTs with the stacked gate insulators have a comparable threshold voltage shift effect with that of the conventional TFTs with Mo electrode and SiOx insulator, under both positive and negative gate bias stresses.
引用
收藏
页码:4299 / 4303
页数:5
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