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Gate Bias Stress-Induced Threshold Voltage Shift Effect of a-IGZO TFTs with Cu Gate
被引:26
|作者:
Liu, Xiang
[1
,2
]
Wang, Lisa Ling
[3
]
Ning, Ce
[2
]
Hu, Hehe
[2
]
Yang, Wei
[2
]
Wang, Ke
[2
]
Yoo, Seong Yeol
[2
]
Zhang, Shengdong
[1
,3
]
机构:
[1] Peking Univ, Inst Microelect, Beijing 100871, Peoples R China
[2] BOE Technol Grp Co Ltd, Technol Res Inst, Beijing 100176, Peoples R China
[3] Peking Univ, Shenzhen Grad Sch, Sch Elect & Comp Engn, Shenzhen 518055, Peoples R China
关键词:
Amorphous indium gallium zinc oxide thin-film transistors (a-IGZO TFTs);
copper diffusion;
copper gate;
stacked gate insulator;
threshold voltage shift;
THIN-FILM TRANSISTORS;
D O I:
10.1109/TED.2014.2362850
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
The gate bias stress-induced threshold voltage shift effect of amorphous indium gallium zinc oxide thin-film transistors (a-IGZO TFTs) with Cu gate is investigated in this brief. It is revealed that the Cu-gated TFTs with SiOx gate insulator suffer from serious electrical performance degradation under gate bias stress owing to Cu diffusion into the gate insulator and channel region. A stacked gate insulator of SiOx/SiNx is then proposed to suppress the Cu diffusion. Experimental results show that the Cu-gated TFTs with the stacked gate insulators have a comparable threshold voltage shift effect with that of the conventional TFTs with Mo electrode and SiOx insulator, under both positive and negative gate bias stresses.
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页码:4299 / 4303
页数:5
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