Analysis of interconnect and package structures using PEEC models with radiated emissions

被引：5

作者：

Pinello, W ^{[1
]}

Ruehli, A ^{[1
]}

Cangellaris, A ^{[1
]}

机构：

[1] Univ Arizona, Dept Elect & Comp Engn, Ctr Elect Packaging Res, Tucson, AZ 85721 USA

来源：

IEEE 1997 INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY - SYMPOSIUM RECORD | 1997年

关键词：

D O I：

10.1109/ISEMC.1997.667703

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The PEEC Partial Element Equivalent Circuit approach is well suited for the modeling of integrated circuits and system interconnect and packages. In this paper, techniques which incorporate the latest enhancements of the PEEC approach are applied to EMI and Electrical Interconnect and Package (EIP) example problems. Our approach corresponds to a full wave solution which accurately determines the high frequency and also the time domain currents and voltages. Two examples are given to illustrate the usefulness of the techniques for both transient and frequency domain electromagnetic simulation, as well as for radiated field calculation.

引用

页码：353 / 358

页数：6

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