Electronic speckle pattern interferometry for mechanical and thermal testing of microobjects

The Electronic Speckle Pattern Interferometry (ESPI) method was adapted to analyse mechanical and thermal properties of thin metallic, polymer and composite films, metallised structures in a real time. Two interferometric systems were designed. The first system was adapted for measuring in-plane deformation of thin films under uniaxial tensile, using a piezoceramic drive device. The second system was adapted to measure out-of-plane deformations of composite films and metallised structures by the thermal expansion. The ESPI works with a thermostat where the temperature of the investigated object varied from -10 to + 60 degrees C according to the given law. The system was designed to measure a saddle, a thin film thermal stresses and thin film thermal expansion coefficient determination.