共 50 条
- [44] Simulation and Measurement of the Solder Bumps with a plastic Core 2013 14TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2013,
- [46] A FUZZY SVM FOR INTELLIGENT DIAGNOSIS OF SOLDER BUMPS USING SCANNING ACOUSTIC MICROSCOPY 2016 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC), 2016,
- [47] Microstructure of lead-free solder bumps using laser reflow soldering INTERNATIONAL SYMPOSIUM ON INTERFACIAL JOINING AND SURFACE TECHNOLOGY (IJST2013), 2014, 61
- [48] Research on defects inspection of solder bumps using active infrared thermography technology Jixie Gongcheng Xuebao/Journal of Mechanical Engineering, 2016, 52 (10): : 17 - 24
- [49] Thermal fatigue life of solder bumps in BGA JSME International Journal, Series A: Mechanics and Material Engineering, 1998, 41 (02): : 260 - 266