Challenges and Trends of SRAM-Based Computing-In-Memory for AI Edge Devices

被引:129
|
作者
Jhang, Chuan-Jia [1 ]
Xue, Cheng-Xin [1 ]
Hung, Je-Min [1 ]
Chang, Fu-Chun [1 ]
Chang, Meng-Fan [1 ]
机构
[1] Natl Tsing Hua Univ, Dept Elect Engn, Hsinchu 30013, Taiwan
关键词
SRAM cells; Computer architecture; Arrays; Common Information Model (computing); Artificial intelligence; Performance evaluation; Microprocessors; Artificial intelligence (AI); Internet of Things (IoT); edge computation; computing-in-memory (CIM); static random access memory (SRAM); SUBTHRESHOLD SRAM; MACRO; TCAM; IMPROVEMENT; SCHEME; RERAM; CMOS; CELL;
D O I
10.1109/TCSI.2021.3064189
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
When applied to artificial intelligence edge devices, the conventionally von Neumann computing architecture imposes numerous challenges (e.g., improving the energy efficiency), due to the memory-wall bottleneck involving the frequent movement of data between the memory and the processing elements (PE). Computing-in-memory (CIM) is a promising candidate approach to breaking through this so-called memory wall bottleneck. SRAM cells provide unlimited endurance and compatibility with state-of-the-art logic processes. This paper outlines the background, trends, and challenges involved in the further development of SRAM-CIM macros. This paper also reviews recent silicon-verified SRAM-CIM macros designed for logic and multiplication-accumulation (MAC) operations.
引用
收藏
页码:1773 / 1786
页数:14
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