Solid state direct bonding of polymers by vacuum ultraviolet light below 160 nm

被引:9
|
作者
Hashimoto, Yuki [1 ]
Yamamoto, Takatoki [1 ]
机构
[1] Tokyo Inst Technol, Dept Mech Engn, Meguro Ku, 2-12-1 Ookayama, Tokyo 1528550, Japan
基金
日本学术振兴会;
关键词
Vacuum ultraviolet light; Surface activated bonding; Polymer; Heat and adhesive free; CHIP; PDMS; LAB;
D O I
10.1016/j.apsusc.2017.04.032
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
This work investigated the application of vacuum ultraviolet (VUV) irradiation to the bonding of various substrates, including glass, polycarbonate (PC), cyclic olefin polymer (COP), polydimethylsiloxane (PDMS) and polymethyl methacrylate (PMMA). This method has the advantage of being able to bond various substrates without the application of heat or adhesives, and therefore may be very useful in the fabrication of micro/nanoscale structures composed of polymers. In contrast to previous applications of this technique, the present study used VUV radiation at wavelengths at and below 160 nm so as to take advantage of the higher energy in this range. Bonding was assessed based on measuring the shear stress of various test specimens subjected to VUV irradiation and then pressed together, and a number of analytical methods were also employed to examine the irradiated surfaces in order to elucidate the morphological and chemical changes following VUV treatment. These analyses included water contact angle measurements, attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR), time of flight secondary ion mass spectrometry (TOF-SIMS) and atomic force microscopy (AFM). Poor bonding was identified between combinations consisting of PMMA/PC, PMMA/COP, PMMA/PMMA, PMMA/glass, and PC/COP, whereas all other combinations resulted in successful bonding with the bonding stress values such as PC/PC = 2.0 MPa, PC/glass = 10.7 MPa and COP/COP = 1.7 MPa, respectively. (C) 2017 Elsevier B.V. All rights reserved.
引用
收藏
页码:319 / 327
页数:9
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