Partnership for lead-free packaging

被引：0
|
作者：
不详
机构：
来源：
R&D MAGAZINE | 2004年 / 46卷 / 10期
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：15 / 15
页数：1
相关论文
共 50 条
  • [21] Lead-free solders and processing issues relevant to microelectronics packaging
    Fournelle, RA
    JOM, 2004, 56 (06) : 33 - 33
  • [22] Research Progress of Nanoscale Lead-free Solder in Electronic Packaging
    Huang, Xi
    Zhang, Liang
    Wang, Xi
    Chen, Chen
    Lu, Xiao
    Cailiao Daobao/Materials Reports, 2024, 38 (23):
  • [23] Low-temperature lead-free SnBiIn solder for electronic packaging
    Shannan Zhang
    Weimin Long
    Peiyan Li
    Fuli Liu
    Hangyan Xue
    Tianran Ding
    Journal of Materials Science: Materials in Electronics, 2024, 35
  • [24] Advances in flip chip underfill technology for lead-free component packaging
    Ghosh, K
    McCabe, M
    Tian, GY
    55TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2005 PROCEEDINGS, 2005, : 1480 - 1485
  • [25] The PSGA, a lead-free CSP for high performance & high reliable packaging
    Vandevelde, B
    Chandrasekhar, A
    Driessens, E
    Beyne, E
    Van Puymbroeck, J
    Heerman, M
    2001 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2001, 4587 : 260 - 263
  • [26] Advances in research and application of lead-free solders for electronic and photonic packaging
    Institute of Material Science and Technology, School of Mechanical Engineering, South China University of Technology, Guangzhou 510640, China
    Cailiao Yanjiu Xuebao, 2008, 1 (1-9):
  • [27] Low-temperature lead-free SnBiIn solder for electronic packaging
    Zhang, Shannan
    Long, Weimin
    Li, Peiyan
    Liu, Fuli
    Xue, Hangyan
    Ding, Tianran
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2024, 35 (10)
  • [28] From leaded to lead-free assembly and new packaging technology challenges
    Lavoie, Helene
    Paquet, Marie-Claude
    Sylvestre, Julien
    Ouimet, Sylvain
    Duchesne, Eric
    Barbeau, Stephane
    Gauvin, Marco
    Oberson, Valerie
    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 1333 - +
  • [29] Lead-free cleaning: Moving from eutectic to lead-free
    Tosun, Umut
    SMT Surface Mount Technology Magazine, 2005, 19 (06): : 47 - 49
  • [30] Interfacial reaction of lead-free solders with lead-free finished leadframes
    Wong, Y. W.
    Wu, C. M. L.
    Woo, H. C. B.
    Choi, Y. T.
    Li, K. L.
    2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006, : 412 - 417
12345