Pressureless low-temperature sintering of plasma activated Ag nanoparticles for high-power device packaging

被引：9

作者：

Fang, Hui ^{[1
]}

Wang, Chenxi ^{[1
]}

Wang, Te ^{[1
]}

Wang, Hong ^{[2
]}

Zhou, Shicheng ^{[1
]}

Huang, Yilong ^{[1
]}

Tian, Yanhong ^{[1
]}

机构：

[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Heilongjiang, Peoples R China

[2] Acad Space Elect Informat Technol, Xian 710100, Shaanxi, Peoples R China

来源：

MATERIALS LETTERS | 2019年 / 256卷

基金：

中国国家自然科学基金; 中国博士后科学基金;

关键词：

Nanoparticles; Sintering; Plasma activation; Low-temperature bonding; Thermal conductivity; Shear strength;

D O I：

10.1016/j.matlet.2019.126620

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A controllable plasma-activated method to achieve pressureless sintering of Ag nanoparticles is proposed for low-temperature bonding. O-2 plasma activation is employed to effectively decompose organics coated on the nanoparticles prior to sintering, avoiding the loose interfacial microstructures. Therefore, robust bonding Cu-Cu joints with high shear strength (>20 MPa) can be formed at a low temperature of 200 degrees C without requiring additional pressure. This rapid and controllable activation method significantly enhances the sinterability of the Ag particles, leading to a dense microstructure. The improved thermal conductivity is three times higher than the one prepared without plasma activation. (C) 2019 Elsevier B.V. All rights reserved.

引用

页数：4

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