Pressureless low-temperature sintering of plasma activated Ag nanoparticles for high-power device packaging

被引：9

作者：

Fang, Hui ^{[1
]}

Wang, Chenxi ^{[1
]}

Wang, Te ^{[1
]}

Wang, Hong ^{[2
]}

Zhou, Shicheng ^{[1
]}

Huang, Yilong ^{[1
]}

Tian, Yanhong ^{[1
]}

机构：

[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Heilongjiang, Peoples R China

[2] Acad Space Elect Informat Technol, Xian 710100, Shaanxi, Peoples R China

来源：

MATERIALS LETTERS | 2019年 / 256卷

基金：

中国国家自然科学基金; 中国博士后科学基金;

关键词：

Nanoparticles; Sintering; Plasma activation; Low-temperature bonding; Thermal conductivity; Shear strength;

D O I：

10.1016/j.matlet.2019.126620

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A controllable plasma-activated method to achieve pressureless sintering of Ag nanoparticles is proposed for low-temperature bonding. O-2 plasma activation is employed to effectively decompose organics coated on the nanoparticles prior to sintering, avoiding the loose interfacial microstructures. Therefore, robust bonding Cu-Cu joints with high shear strength (>20 MPa) can be formed at a low temperature of 200 degrees C without requiring additional pressure. This rapid and controllable activation method significantly enhances the sinterability of the Ag particles, leading to a dense microstructure. The improved thermal conductivity is three times higher than the one prepared without plasma activation. (C) 2019 Elsevier B.V. All rights reserved.

引用

页数：4

共 50 条

[1] Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging
Wang, Shuai
Li, Mingyu
Ji, Hongjun
Wang, Chunqing
SCRIPTA MATERIALIA, 2013, 69 (11-12) : 789 - 792
[2] Pressureless and low temperature sintering by Ag paste for the high temperature die-attachment in power device packaging
Wang, Chuncheng
Zhang, Xu
Zhang, Yudui
Zhao, Tao
Zhu, Pengli
Sun, Rong
Nishikawa, Hiroshi
Xu, Liang
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 2256 - 2262
[3] Solvent effect on pressureless and low-temperature sintering of Ag paste for die-attachment in high-power devices
Zhang, Hao
Chen, Chuantong
Jiu, Jinting
Suganuma, Katsuaki
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 624 - 627
[4] High-temperature reliability of low-temperature and pressureless micron Ag sintered joints for die attachment in high-power device
Hao Zhang
Chuantong Chen
Jinting Jiu
Shijo Nagao
Katsuaki Suganuma
Journal of Materials Science: Materials in Electronics, 2018, 29 : 8854 - 8862
[5] High-temperature reliability of low-temperature and pressureless micron Ag sintered joints for die attachment in high-power device
Zhang, Hao
Chen, Chuantong
Jiu, Jinting
Nagao, Shijo
Suganuma, Katsuaki
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 29 (10) : 8854 - 8862
[6] Preparation and Low-Temperature Sintering of Cu Nanoparticles for High-Power Devices
Krishnan, Shutesh
Haseeb, A. S. M. A.
Johan, Mohd Rafie
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 2 (04): : 587 - 592
[7] Pressureless Low Temperature Sintering of Ag Nanoparticles for Interconnects
Wang, Shuai
Ji, Hongjun
Li, Mingyu
Kim, Jongmyung
Kim, Hongbae
14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012), 2012,
[8] Low-temperature MOD assisted sintering of Ag nanoparticles for power device die-attach
Liu, Xun
Li, Junjie
Liu, Li
Zhu, Pengli
Zhao, Tao
Sun, Rong
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), 2021, : 532 - 537
[9] Low-Temperature Plasma for High-Power Tuning
Semnani, Abbas
Macheret, Sergey O.
Peroulis, Dimitrios
2017 IEEE MTT-S INTERNATIONAL MICROWAVE WORKSHOP SERIES ON ADVANCED MATERIALS AND PROCESSES FOR RF AND THZ APPLICATIONS (IMWS-AMP), 2017,
[10] Low-Temperature Die Attachment by Pressureless Cu Sintering for Semiconductor Packaging
Jingru Dai
Yangang Wang
Thomas Grant
Muhmmad Morshed
Journal of Electronic Materials, 2023, 52 : 7607 - 7613

← 1 2 3 4 5 →