Characterization of the ultrathin HfO2 and Hf-silicate films grown by atomic layer deposition

被引:30
|
作者
Chen, Tze Chiang [1 ]
Peng, Cheng-Yi
Tseng, Chih-Hung
Liao, Ming-Han
Chen, Mei-Hsin
Wu, Chih-I
Chern, Ming-Yau
Tzeng, Pei-Jer
Liu, Chee Wee
机构
[1] Natl Taiwan Univ, Dept Elect Engn, Grad Inst Elect Engn, Taipei 10617, Taiwan
[2] Natl Taiwan Univ, Grad Inst Elect Engn, Taipei 10617, Taiwan
[3] Natl Taiwan Univ, Dept Phys, Taipei 10617, Taiwan
[4] Ind Technol Res Inst, Elect Res & Serv Org, Hsinchu 310, Taiwan
关键词
Fourier transform infrared (FTIR); HfO2; Hf-silicate; high-k; X-ray photoelectron spectroscopy (XPS); X-ray reflectivity (XRR);
D O I
10.1109/TED.2007.892012
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The physical properties of HfO2 and Hf-silicate layers grown by the atomic layer chemical vapor deposition are characterized as a function of the Hf concentration and the annealing temperature. The peaks of Fourier transform infrared spectra at 960, 900, and 820 cm(-1) originate from Hf-O-Si chemical bonds, revealing that a Hf-silicate interfacial layer began to form at the HfO2/SiO2 interface after postdeposition annealing process at 600 degrees C for 1 min. Moreover, the intensity of the peak at 750 cm(-1) can indicate the degree of crystallization of HfO2. The formed Hf-silicate layer between HfO2 and SiO2 is also confirmed by X-ray photoelectron spectroscopy.
引用
收藏
页码:759 / 766
页数:8
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