Residual Thermo-mechanical stresses in ultra thin chip stack technology

被引：1
|
作者：
Puigcorbé, J [1 ]
Leseduarte, S [1 ]
Marco, S [1 ]
Beyne, E [1 ]
Van Hoof, R [1 ]
Marty, A [1 ]
Pinel, S [1 ]
Vendier, O [1 ]
Coello-Vera, A [1 ]
机构：
[1] Univ Barcelona, Dept Elect, E-08028 Barcelona, Spain
来源：
DESIGN, TEST, INTEGRATION, AND PACKAGING OF MEMS/MOEMS, PROCEEDINGS | 2000年 / 4019卷
关键词：
residual stress; FEM; chip stack; creep; BCB; copper; interconnects; MCM;
D O I：
10.1117/12.382329
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The aim of this work is to analyze the thermo-mechanical stresses evolution produced during the fabrication sequence of the multi-level UTCS structure. Several non-linear material models have been taken into account during the process modeling. We have therefore resorted to the Finite Element Method for the evaluation of such thermo-mechanical stresses that appears in the manufacturing and stacking process. These efforts are made to optimize the product and process design.
引用
收藏
页码：315 / 323
页数：9
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